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Global Fan-out Wafer Level Packaging (High-Density & Standard Density) Market Report 2019-2023

Dublin, Dec. 14, 2018 (GLOBE NEWSWIRE) -- The "Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023" report has been added to ResearchAndMarkets.com's offering.

The fan-out wafer level packaging (FOWLP) market will register a CAGR of almost 16% by 2023.

The introduction of panel level packaging has reduced the overall cost of wafer level packaging. The overall cost of packaging is lowered by shifting the whole packaging process to a large size panel format. This allows simultaneous packaging of several components on the same substrate. Panel level packaging technology significantly reduces the manufacturing costs for substrate manufacturers, IDMs, OSAT companies, and fabless companies. The increasing demand for electronics across different industries will further drive the demand for panel level packaging and thereby boost fan-out wafer level packaging market growth.

Market Overview

Increasing demand for compactly designed electronics

The demand for miniaturized semiconductor components is increasing. This is prompting semiconductor companies to develop new packaging technologies such as FOWLP which will reduce the overall size of packaged ICs. FOWLP technology is suitable for applications that require high power and extreme miniaturization. This packaging technology also reduces the packaging and testing costs by allowing the fabrication and testing at wafer level. The growing demand for compact electronics will further drive thee demand for FOWLP technology and thereby boost market growth.

Increased production costs due to warpage

Warping is the deformation of the wafer surface due to differential shrinkage of the material in the molded part. Warping makes the wafers unusable and since it occurs several times during FOWLP, the manufacturing cost of the wafer increases. Warping can occur after post mold cure (PMC), after back grinding of the EMC, or after the fabrication of redistribution layers (RDLs). Warpage increases the overall packaging and manufacturing cost which in turn hampers the growth of FOWLP market.

Competitive Landscape

The market appears to be concentrated and with the presence of few companies including Amkor Technology, and ASE Technology Holding the competitive environment is less intense. Factors such as the growing demand for compactly designed electronics, will provide considerable growth opportunities to fan-out wafer level packaging (FOWLP) companies.

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 04: MARKET SIZING

  • Market definition
  • Market sizing 2018
  • Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 06: MARKET SEGMENTATION BY TECHNOLOGY

  • Market segmentation by technology
  • Comparison by technology
  • High density FOWLP - Market size and forecast 2018-2023
  • Standard density FOWLP - Market size and forecast 2018-2023
  • Market opportunity by technology

PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2018-2023
  • Americas - Market size and forecast 2018-2023
  • EMEA - Market size and forecast 2018-2023
  • Key leading countries
  • Market opportunity

PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 11: TRENDS

  • Increasing adoption of semiconductor ICs in automobiles
  • Introduction of panel level packaging
  • Incorporation of more functionalities in smartphones

PART 12: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption

PART 13: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Amkor Technology
  • ASE Technology Holding
  • Samsung Electro-Mechanics
  • STATS ChipPAC
  • Taiwan Semiconductor Manufacturing Company

PART 14: APPENDIX

For more information about this report visit https://www.researchandmarkets.com/research/qcd6pg/global_fanout?w=12

Research and Markets also offers Custom Research services providing focused, comprehensive and tailored research.

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                    Related Topics: Semiconductor
                    

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